Page 38 - 電路板季刊第88期

36 專業技術 銅導線表面處理與銅箔粗糙度對5G高頻高速傳輸的影響

[13] W.L. Chou, Y.S. Wu, C.Y. Lee, C.S. Chen, C.C. Huang, C.E. Ho, Proceeding of the
14th International Microsystems, Packaging, Assembly and Circuits Technology
Conference (IMPACT 2019), Taipei, p. 344, 2019.
[14] I. Rosu, Microstrip stripline and CPW design, Tech Rep, 2012.

[15] S. Groisse, I. Bardi, O. Biro, K. Preis, K.R. Richter, IEEE Trans Magn., vol. 32, p.
894, 1996.
[16] P.G. Huray, The Foundations of Signal Integrity, John Wiley & Sons, Inc., Hoboken,
USA, 2009.

[17] S.H. Hall, H.L. Heck, Advanced Signal Integrity for High-Speed Digital Designs,
Canada, Wiley-IEEE Press, 2009.
[18] R.G. Carter, Electromagnetic Waves: Microwave Components and Devices, Chapman
and Hall, London, 1990.

[19] Z. Popovic, B. D. Popovic, Introductory Electromagnetics, Prentice Hall, New Jersey,
2000.
[20] 何政恩, 電子構裝與銅表面處理技術(Electronic Packages and Surface Finish
Technology of Copper), 台灣電路板協會(TPCA)專書, 桃園, 2018.