Page 126 - 電路板季刊第88期
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PLENARY SPEAKERS
SCOPE
PCB
PACKAGING
Marvin Liao David Chang John H. Lau Wenchi Ting
Vice President Senior Managing Consultant CTO Vice President PAPER AWARD
TSMC IBM Global Business Services Unimicron UMC Outstanding paper award
REGISTER NOW! will be selected
join us this year to engage with the latest market trend on PCB
and packaging topics. IMPACT-EMAP 2020 will arrange
plenary speeches, special sessions, industrial sessions, invited SPONSOR
talks, and outstanding paper and poster presentations.
Meanwhile, this conference will keep collaborating with Developing exclusive
international organizations such as ICEP 、JIEP from Japan, professional connections
KAIST from South Korea, and iNEMI from USA in this year’s
gathering. INDUSTRIAL SESSION
Contact us +886-3-3815659 #407 #404 #405 Email: service@impact.prg.tw
